IP Library › Assignment 025710/0520
Patent Assignment
Reel/Frame 025710/0520

Assignment of Assignor's Interest

Recorded: 2011-01-28 Pages: 3
Assignors
YAMAZAKI, TAKAO
Executed: 2011-01-12
SANO, MASAHIKO
Executed: 2011-01-12
KURASHINA, SEIJI
Executed: 2011-01-12
SOGAWA, YOSHIMICHI
Executed: 2011-01-12
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Encapsulating Package, Printed Circuit Board, Electronic Device and Method for Manufacturing Encapsulating Package
Patent: 8,525,323 →
Application: 13/054,251 →
Publication: US 2011/0114840
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 28, 2015
From: NEC CORPORATION
To: GODO KAISHA IP BRIDGE 1
Reel/Frame 034834/0806 →