Patent Assignment
Reel/Frame 025732/0212
Assignment of Assignor's Interest
Recorded: 2011-02-02
Pages: 3
Assignee
TRIQUINT SEMICONDUCTOR, INC.
P.O. BOX 609501, ORLANDO, FLORIDA, 32860-9501
Covered Property
(1)
Wafer Level Package with Embedded Passive Components and Method of Manufacturing
Patent:
8,680,683 →
Application:
12/957,004 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.