Assignment of Assignor's Interest

Recorded: 2011-02-01 Pages: 2

Assignors

TSUBAKI, RYUJI

Executed: 2010-01-28

MATSUOKA, YASUFUMI

Executed: 2010-01-28

Assignee

ROHM CO., LTD.

21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, KYOTO 615-8585, JAPAN

Covered Property (1)

Wire Bonding Structure of Semiconductor Device and Wire Bonding Method

Patent: 9,379,085 →

Application: 13/018,993 →

Publication: US 2011/0241224