Patent Assignment
Reel/Frame 025773/0766
Assignment of Assignor's Interest
Recorded: 2010-12-30
Pages: 6
Assignors
ABLES, BILLY D.
Executed: 2002-02-26
EHMKE, JOHN C.
Executed: 2002-02-26
GOOCH, ROLAND W.
Executed: 2002-03-04
Assignee
RAYTHEON COMPANY
870 WINTER STREET, WALTHAM, MASSACHUSETTS, 02451-1447
Covered Property
(1)
Method and Apparatus for Packaging Circuit Devices
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 20, 2012
From: RAYTHEON COMPANY
To: INVENSAS CORPORATION
Reel/Frame 029046/0885 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →