Patent Assignment
Reel/Frame 025777/0204
Assignment of Assignor's Interest
Recorded: 2011-02-09
Pages: 3
Assignee
SANKEN ELECTRIC CO., LTD.
6-3, KITANO 3-CHOME, NIIZA-SHI, SAITAMA, JAPAN
Covered Property
(1)
Semiconductor Wafer and Manufacturing Method of Semiconductor Device