IP Library › Assignment 025778/0987
Patent Assignment
Reel/Frame 025778/0987

Assignment of Assignor's Interest

Recorded: 2011-02-09 Pages: 3
Assignors
YEH, WEI-YU
Executed: 2011-02-07
SUN, CHIH-HSUAN
Executed: 2011-02-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Systems and Methods Providing Thermal Spreading for an Led Module
Patent: 8,737,073 →
Application: 13/024,017 →
Publication: US 2012/0201007
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 21, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027903/0100 →
Change of Name Nov 25, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037160/0220 →
Merger Nov 25, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037160/0234 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →