Patent Assignment
Reel/Frame 027903/0100
Assignment of Assignor's Interest
Recorded: 2012-03-21
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Systems and Methods Providing Thermal Spreading for an Led Module
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 9, 2011
From: YEH, WEI-YU; SUN, CHIH-HSUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025778/0987 →
Change of Name
Nov 25, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037160/0220 →
Merger
Nov 25, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037160/0234 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →