Patent Assignment
Reel/Frame 025786/0525
Assignment of Assignor's Interest
Recorded: 2011-02-10
Pages: 3
Assignor
WANG, SHIANG-BAU
Executed: 2011-02-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Isolation Structure Profile for Gap Filling