Patent Assignment
Reel/Frame 025799/0822
Assignment of Assignor's Interest
Recorded: 2011-02-15
Pages: 5
Assignors
KIM, TAE-HUN
Executed: 2011-01-27
PARK, JIN-WOO
Executed: 2011-01-27
CHOI, DAE-YOUNG
Executed: 2011-01-27
KIM, MI-YEON
Executed: 2011-01-27
LEE, SUN-HYE
Executed: 2011-01-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Package-on-Package and Device Related Thereto