Patent Assignment
Reel/Frame 025801/0681
Assignment of Assignor's Interest
Recorded: 2011-02-14
Pages: 3
Assignor
SHIH, PING-CHIA
Executed: 2011-02-11
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Chip Package Structure, Semiconductor Chip and Semiconductor Chip Group
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.