Patent Assignment
Reel/Frame 025809/0807
Assignment of Assignor's Interest
Recorded: 2011-02-15
Pages: 5
Assignees
GLOBALFOUNDRIES SINGAPORE PTE, LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Methods and Structures to Enable Self-Aligned via Etch for Cu Damascene Structure Using Trench First Metal Hard Mask (Tfmhm) Scheme
Patent:
8,114,769 →
Application:
12/982,956 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.