IP Library Assignment 025833/0545
Patent Assignment
Reel/Frame 025833/0545

Assignment of Assignor's Interest

Recorded: 2011-02-18 Pages: 3
Assignors
HU, KEVIN (KUNZHONG)
Executed: 2011-02-16
LAW, EDWARD
Executed: 2011-02-16
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVENUE, IRVIINE, CALIFORNIA, 92617
Covered Property (1)
Thermal Enhanced Package Using Embedded Substrate
Patent: 9,564,391 →
Application: 13/030,470 →
Publication: US 2012/0175773
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
Assignment of Assignor's Interest Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
Merger Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047422 Frame: 0464. Assignor(S) Hereby Confirms the Merger. Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →