Patent Assignment
Reel/Frame 025836/0285
Assignment of Assignor's Interest
Recorded: 2011-02-21
Pages: 3
Assignors
TOMURA, YOSHIHIRO
Executed: 2010-10-12
SHIMIZU, KAZUMICHI
Executed: 2010-10-12
KUMAZAWA, KENTARO
Executed: 2010-10-12
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Device, Flip-Chip Mounting Method and Flip-Chip Mounting Apparatus