Patent Assignment
Reel/Frame 025840/0803
Assignment of Assignor's Interest
Recorded: 2011-02-22
Pages: 3
Assignors
SU, YAN-KUIN
Executed: 2011-01-18
CHEN, KUAN-CHUN
Executed: 2011-01-20
LIN, CHUN-LIANG
Executed: 2011-01-20
Assignee
NATIONAL CHENG KUNG UNIVERSITY
NO. 1, TA-HSUEH ROAD, TAINAN CITY, TAIWAN
Covered Property
(1)
Method for Manufacturing Heat Dissipation Bulk of Semiconductor Device