Patent Assignment
Reel/Frame 025841/0761
Assignment of Assignor's Interest
Recorded: 2011-02-22
Pages: 4
Assignors
LEE, JAE-HAK
Executed: 2011-02-21
LEE, CHANG-WOO
Executed: 2011-02-21
SONG, JOON-YUB
Executed: 2011-02-21
HA, TAE-HO
Executed: 2011-02-21
Assignee
KOREA INSTITUTE OF MACHINERY & MATERIALS
171, JANG-DONG, YOUSEONG-KU, DAEJEON-CITY, 305-343, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating a Tsv for 3D Packaging of Semiconductor Device