Patent Assignment
Reel/Frame 025867/0325
Assignment of Assignor's Interest
Recorded: 2011-02-25
Pages: 2
Assignee
ISHIHARA SANGYO KAISHA, LTD.
3-15 EDOBORI 1-CHOME, NISHI-KU, OSAKA-SHI, OSAKA, JAPAN
Covered Property
(1)
Metallic Copper Dispersion, Process for Producing the Metallic Copper Dispersion, Electrode, Wiring Pattern, and Coating Film Formed Using the Metallic Copper Dispersion, Decorative Article and Antimicrobial Article with the Coating Film Formed Thereon, and Processes for Producing the Decorative Article and the Antimicrobial Article