Patent Assignment
Reel/Frame 025868/0104
Assignment of Assignor's Interest
Recorded: 2011-02-25
Pages: 3
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, TAOYUAN COUNTY, JHONGLI CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Fabrication Method Thereof