Patent Assignment
Reel/Frame 025873/0276
Assignment of Assignor's Interest
Recorded: 2011-02-28
Pages: 4
Assignors
OONISHI, KENJI
Executed: 2011-02-23
HAYASHI, MIKI
Executed: 2011-02-23
INOUE, KOUICHI
Executed: 2011-02-23
SHISHIDO, YUICHIRO
Executed: 2011-02-23
Assignee
NITTO DENKO CORPORATION
1-1-2, SHIMOHOZUMI, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Die Bond Film, Dicing Die Bond Film, and Semiconductor Device