Patent Assignment
Reel/Frame 025882/0385
Assignment of Assignor's Interest
Recorded: 2011-03-01
Pages: 4
Assignors
HLAD, MARK S
Executed: 2011-02-04
SALAMA, ISLAM A
Executed: 2011-02-04
ROY, MIHIR K
Executed: 2011-02-04
WU, TAO
Executed: 2011-02-04
LIU, YUELI
Executed: 2011-02-04
LEE, KYU OH
Executed: 2011-02-04
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Device Packaging with Substrates Having Embedded Lines and Metal Defined Pads