Patent Assignment
Reel/Frame 025894/0988
Assignment of Assignor's Interest
Recorded: 2011-03-03
Pages: 2
Assignors
LEE, BAIK-WOO
Executed: 2011-02-08
LIM, JI-HYUK
Executed: 2011-02-08
BOOH, SEONG-WOON
Executed: 2011-02-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Laminate Package and Method of Manufacturing the Same