Patent Assignment
Reel/Frame 025895/0122
Assignment of Assignor's Interest
Recorded: 2011-03-01
Pages: 2
Assignors
MINAMI, HISATAKA
Executed: 2011-02-07
SAISYO, RYOUTA
Executed: 2011-02-07
ONO, HIROSHI
Executed: 2011-02-09
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO 163-0449, JAPAN
Covered Property
(1)
Polishing Solution for Cmp, and Method for Polishing Substrate Using the Polishing Solution for Cmp
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Oct 14, 2014
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 033987/0352 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →