Patent Assignment
Reel/Frame 025912/0453
Assignment of Assignor's Interest
Recorded: 2011-03-07
Pages: 3
Assignors
HOSHINO, SHINJI
Executed: 2011-02-14
ARIMITSU, YUKIO
Executed: 2011-02-14
KIUCHI, KAZUYUKI
Executed: 2011-02-14
MURATA, AKIHISA
Executed: 2011-02-14
Assignee
NITTO DENKO CORPORATION
1-1-2, SHIMOHOZUMI, IBARAKI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Heat-Resistant Adhesive Sheet for Substrateless Semiconductor Package Fabrication and Method for Fabricating Substrateless Semiconductor Package Using the Adhesive Sheet