Patent Assignment
Reel/Frame 025917/0353
Assignment of Assignor's Interest
Recorded: 2011-03-08
Pages: 5
Assignors
HUI, KEUNG
Executed: 2010-11-11
SUNG, JIN-NING
Executed: 2010-11-18
KANG, HUANG SOON
Executed: 2010-11-22
TSEN, YEN-DI
Executed: 2010-11-17
MOU, JONG-I
Executed: 2010-11-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Apparatus and Method for Target Thickness and Surface Profile Uniformity Control of Multi-Head Chemical Mechanical Polishing Process