Patent Assignment
Reel/Frame 025919/0553
Assignment of Assignor's Interest
Recorded: 2011-03-08
Pages: 2
Assignors
PARK, JIN-WOO
Executed: 2011-01-14
LIM, HWAN-SIK
Executed: 2011-01-19
AHN, EUNCHUL
Executed: 2011-01-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Package Substrates and Semiconductor Packages Having the Same