IP Library › Assignment 025929/0782
Patent Assignment
Reel/Frame 025929/0782

Assignment of Assignor's Interest

Recorded: 2011-03-09 Pages: 4
Assignors
BACHMAN, MARK
Executed: 2008-09-09
OSENBACH, JOHN
Executed: 2008-09-09
Assignee
AGERE SYSTEMS INC.
1110 AMERICAN PARKWAY NE, ALLENTOWN, PENNSYLVANIA, 18109
Covered Property (1)
Pb-Free Solder Bumps with Improved Mechanical Properties
Patent: 8,779,587 →
Application: 13/063,181 →
Publication: US 2011/0163441
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Certificate of Formation/Certificate of Conversion Jun 2, 2014
From: AGERE SYSTEMS INC
To: AGERE SYSTEMS LLC
Reel/Frame 033075/0478 →
Assignment of Assignor's Interest Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Patent Security Agreement Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →