IP Library › Assignment 033075/0478
Patent Assignment
Reel/Frame 033075/0478

Certificate of Formation/Certificate of Conversion

Recorded: 2014-06-02 Pages: 5
Assignor
AGERE SYSTEMS INC
Executed: 2012-07-24
Assignee
AGERE SYSTEMS LLC
2711 CENTERVILLE ROAD, WILMINGTON, DELAWARE, 19808
Covered Property (1)
Pb-Free Solder Bumps with Improved Mechanical Properties
Patent: 8,779,587 →
Application: 13/063,181 →
Publication: US 2011/0163441
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 9, 2011
From: BACHMAN, MARK; OSENBACH, JOHN
To: AGERE SYSTEMS INC.
Reel/Frame 025929/0782 →
Assignment of Assignor's Interest Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Patent Security Agreement Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →