Patent Assignment
Reel/Frame 025931/0496
Assignment of Assignor's Interest
Recorded: 2011-03-10
Pages: 2
Assignor
SINGH, HARPUNEET
Executed: 2009-10-26
Assignee
FLEXTRONICS AP LLC
305 INTERLOCKEN PARKWAY, BROOMFIELD, COLORADO, 80021
Covered Property
(1)
Small Form Factor Modules Using Wafer Level Optics with Bottom Cavity and Flip-Chip Assembly
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 12, 2012
From: FLEXTRONICS AP, LLC
To: DIGITALOPTICS CORPORATION
Reel/Frame 028948/0790 →
Assignment of Assignor's Interest
Feb 3, 2015
From: DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; FOTONATION LIMITED
To: NAN CHANG O-FILM OPTOELECTRONICS TECHNOLOGY LTD
Reel/Frame 034883/0237 →