Patent Assignment
Reel/Frame 028948/0790
Assignment of Assignor's Interest
Recorded: 2012-09-12
Pages: 13
Assignor
FLEXTRONICS AP, LLC
Executed: 2012-06-28
Assignee
DIGITALOPTICS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(100)
Method for Aligning and Assembling Two Lens Pieces, and a Machine to Accomplish This Task
PCT:
PCT/US2006/029572 ↗
Method of Aligning the Upper and Lower Centering Bells of a Lens Doublet Assembly Machine
PCT:
PCT/US2006/029573 ↗
Auto-Focus and Zoom Module
PCT:
PCT/US2006/034792 ↗
Micro Camera Module with Discrete Manual Focal Positions
PCT:
PCT/US2006/035660 ↗
Wafer Based Camera Module and Method of Manufacture
PCT:
PCT/US2006/039521 ↗
Manufacturable Micropositioning System Emplyoying Non-Linear Actuator
PCT:
PCT/US2007/017696 ↗
Zoom Module Using Rotational Actuator with Anti-Lock Feature, Even Force Distribution and Shock Damage Prevention Methods
PCT:
PCT/US2007/017698 ↗
Auto-Focus and Zoom Module with Vibrational Actuator and Position Sensing Method
PCT:
PCT/US2007/019933 ↗
Camera Module with Contamination Reduction Feature
PCT:
PCT/US2007/023335 ↗
Camera Module Contamination Reduction Gasket
PCT:
PCT/US2007/023388 ↗
Actuated Stepper Lens Camera Module
PCT:
PCT/US2007/024923 ↗
Three-Element Photographic Objective with Reduced Tolerance Sensitivities
PCT:
PCT/US2007/026335 ↗
Zoom Lens System for Use with Small Electronic Sensor
PCT:
PCT/US2007/064840 ↗
Attaching Passive Components to a Semiconductor Die
PCT:
PCT/US2007/088949 ↗
Wafer Level Camera Module and Method of Manufacture
PCT:
PCT/US2008/001083 ↗
Small Form Factor Modules Using Wafer Level Optics with Bottom Cavity and Flip Chip Assembly
PCT:
PCT/US2008/005289 ↗
Auto Focus/ Zoom Modules Using Wafer Level Optics
PCT:
PCT/US2008/005298 ↗
Camera Blade Shutter Module
PCT:
PCT/US2008/005405 ↗
Miniature Camera Shutter and Filter/Aperture
PCT:
PCT/US2008/005659 ↗
Camera Module Back-Focal Length Adjustment Method and Ultra Compact Components Packaging
PCT:
PCT/US2008/008708 ↗
Tele Wide Module
PCT:
PCT/US2008/008999 ↗
Attachment of Wafer Level Optics
PCT:
PCT/US2009/034528 ↗
Wafer Level Camera Module with Molded Housing and Method of Manufacture
PCT:
PCT/US2010/002251 ↗
Camera Module with Fold-Over Flexible Circuit and Cavity Substrate
PCT:
PCT/US2010/002913 ↗
Calibration Techniques for Camera Modules
PCT:
PCT/US2010/025958 ↗
Dual Sensor Camera
PCT:
PCT/US2010/028014 ↗
Micro Camera Module with Discrete Manual Focal Positions
Wafer Based Camera Module and Method of Manufacture
Method for Aligning and Assembling Two Lens Pieces, and a Machine to Accomplish This Task
Method of Aligning the Upper and Lower Centering Bells of a Lens Doublet Assembly Machine
Auto-Focus and Zoom Module Having a Lead Screw with Its Rotation Results in Translation of an Optics Group (as Amended)
Three-Element Photographic Objective with Reduced Tolerance Sensitivities
Zoom Lens System for Use with Small Electronic Sensor
Wafer Level Camera Module and Method of Manufacture
Electronic Component Structure and Method of Making
Laser Bonding Camera Modules to Lock Focus
Manufacturable Micropositioning System Employing Sensor Target
Zoom Module Using Actuator and Lead Screw with Translating Operation
Auto-Focus and Zoom Module with Vibrational Actuator and Position Sensing Method
Camera Module Back-Focal Length Adjustment Method and Ultra Compact Components Packaging
Camera Module with Contamination Reduction Feature
Camera Module Contamination Reduction Gasket
Actuated stepper lens camera module
Application:
11/998,992 →
Publication:
US 2008/0225415
A Configurable Tele Wide Module
Glass-On-Die Attachment Method for Image Sensors
Application:
12/136,033 →
Small Form Factor Modules Using Wafer Level Optics with Bottom Cavity and Flip-Chip Assembly
Auto focus/zoom modules using wafer level optics
Application:
12/150,119 →
Publication:
US 2009/0015706
Camera Blade Shutter Module
Miniature Camera Shutter and Filter/Aperture
Auto-Focus and Zoom Module with Vibrational Actuator and Position Sensing Method
Backlash Prevention System and Method
Micro Camera Module with Discrete Manual Focal Positions
Techniques for Glass Attachment in an Image Sensor Package
Application:
12/343,985 →
Attachment of Wafer Level Optics
Image Space Focus
Application:
12/432,590 →
Publication:
US 2010/0277638
Dual Lens Digital Zoom
Techniques for Glass Attachment in an Image Sensor Package
Wafer level camera module with molded housing and method of manufacturing
Camera Module with Fold Over Flexible Circuit and Cavity Substrate
Optical Navigation Device with Image Sensor and Inner Housing
Af/Zoom Shutter with Two Blades Function
Calibration Techniques for Camera Modules
Application:
12/716,128 →
Publication:
US 2010/0321506
Dual Sensor Camera
Camera Module Back-Focal Length Adjustment Method and Ultra Compact Components Packaging
Three-Pole Tilt Control System for Camera Module
Micro Camera Module with Discrete Manual Focal Positions
Auto Focus-Zoom Actuator or Camera Module Contamination Reduction Feature with Integrated Protective Membrane
Camera Module Back-Focal Length Adjustment Method and Ultra Compact Components Packaging
Application:
13/149,638 →
Publication:
US 2011/0228154
System for Stabilizing an Optics Assembly During Translation
Low Profile Camera Module Packaging
Flash System for Camera Module
Autofocus-Zoom Camera Module Integrating Liquid Crystal Device as High Speed Shutter
Autofocus Camera Module Packaging with Circuitry-Integrated Actuator System
Camera Module with Protective Air Ventilation Channel
Camera Module with Threadless Lens Barrel Engagement Design
Multi-Direction Sfr Measurement System
Application:
13/476,420 →
Publication:
US 2012/0293666
Method for aligning the upper and lower centering bells of a lens doublet assembly machine
Application:
60/703,531 →
RFID tag system
Application:
60/703,539 →
3X zoom mini module
Application:
60/715,533 →
Zoom Lens for Use with Small Electronic Sensor
Application:
60/743,767 →
Miniaturized zoom module with rotational piezo actuator with anti-lock feature, even force distribution, shock damage prevention and a novel position sensing methods
Application:
60/836,616 →
Zoom module with piezo wave actuator using end stop and AF/Zoom position sensing method, arrangement and method of direct activation of front lens(AF/Zoom) and rear lens (zoom) compartments through special configured piezo wave actuator
Application:
60/844,781 →
Camera Module with Contamination Reduction Feature
Application:
60/864,348 →
Actuated stepper lens camera module
Application:
60/872,142 →
Attaching Passive Components to a Semiconductor Die
Application:
60/891,655 →
Small form factor modules using wafer level optics with bottom cavity and flip chip assembly
Application:
60/925,946 →
Auto focus / zoom modules using wafer level optics
Application:
60/925,947 →
Miniature camera shutter and filter/aperture
Application:
60/928,135 →
Glass-On-Die Attachment Method for Image Sensors
Application:
60/942,953 →
Camera module back-focal length adjustment method and ultra compact components packaging
Application:
60/961,312 →
Attachment of Wafer Level Optics
Application:
61/030,937 →
Calibration Techniques for Camera Modules
Application:
61/156,692 →
Dual Sensor Camera
Application:
61/161,621 →
Flash System for Camera Module
Application:
61/446,113 →
Autofocus-Zoom Camera Module Integrating Liquid Crystal Device as High Speed Shutter
Application:
61/446,151 →
Autofocus Camera Module Packaging with Circuitry-Integrated Actuator System
Application:
61/446,156 →
Low Profile Camera Module Packaging
Application:
61/446,163 →
Camera Module with Protective Air Ventilation Channel
Application:
61/450,040 →
Camera Module With Threadless Lens Barrel Engagement Design
Application:
61/485,276 →
Multi-Direction SFR Measurement System
Application:
61/487,895 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 11, 2012
From: FLEXTRONICS SALES & MARKETING (A-P) LTD.
To: DIGITALOPTICS CORPORATION
Reel/Frame 028937/0975 →
Assignment of Assignor's Interest
Sep 12, 2012
From: FLEXTRONICS INTERNATIONAL USA, INC.
To: DIGITALOPTICS CORPORATION
Reel/Frame 028942/0876 →
Assignment of Assignor's Interest
Feb 3, 2015
From: DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; FOTONATION LIMITED
To: NAN CHANG O-FILM OPTOELECTRONICS TECHNOLOGY LTD
Reel/Frame 034883/0237 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →