CAMERA MODULE BACK-FOCAL LENGTH ADJUSTMENT METHOD AND ULTRA COMPACT COMPONENTS PACKAGING

1 .- 25 . (canceled)

26 . An ultra compact camera comprising:

a. a base substrate having a first surface, a second surface, and an aperture;

b. an imaging device, the imaging device having an active surface and a passive surface, wherein imaging device is coupled to the second surface of the base substrate such that the active surface faces the aperture.

27 . The ultra compact camera of claim 26 wherein the imaging device is mounted to base substrate by a flip chip method.

28 . The ultra compact camera of claim 26 wherein the imaging device comprises an array of charge coupled devices.

29 . The ultra compact camera of claim 26 wherein the imaging device is mounted to the substrate by conductive bumps.

30 . The ultra compact camera of claim 26 further comprising an actuator mounted to the first surface of the base substrate.

31 . The ultra compact camera of claim 30 wherein the actuator comprises an opening on a first end and second end defining a barrel cavity for allowing light to pass therethrough to the active surface of the imaging device.

32 . The ultra compact camera of claim 31 further comprising a lens mounted within the barrel cavity, wherein the focuses the lens with respect to the imaging device.

33 . The ultra compact camera of claim 32 wherein the lens is mounted to the actuator by threading.

34 . The ultra compact camera of claim 33 wherein the treading comprises ramps.

35 . The ultra compact camera of claim 26 further comprising additional electrical components mounted to the substrate, wherein the additional electrical components are in electrical communication with the imaging device.

36 . The ultra compact camera of claim 35 wherein the additional electrical components are mounted to the first surface of the substrate.

37 . The ultra compact camera of claim 36 wherein the substrate comprises electrical connections therethrough for enabling electrical communication between the additional components and the imaging device.

38 . An ultra compact camera housing comprising:

a. a base substrate having a first surface and a second surface and an aperture;

b. an imaging device, having an image sensing surface, mounted using flip chip techniques on the second side of the base substrate such that the image sensing surface is exposed through the aperture;

c. an actuator assembly having a lens housed therein coupled to the first surface of the base substrate such that light is allowed to pass through the lens and the aperture for affecting the image sensing surface, wherein the actuator moves the lens for focusing an image onto the image sensing surface.

39 . The ultra compact camera housing of claim 38 further comprising at least one additional electrical component coupled to the first surface of the base substrate, wherein the at least one additional electrical component is electrically coupled to the imaging device.

40 . A camera comprising:

a. a base substrate having an aperture; and

b. an imaging device having an imaging surface, wherein the imaging surface is coupled to the base substrate such that the imaging surface is exposed through the aperture.

41 . The camera of claim 40 wherein the imaging device is mounted to base substrate by a flip chip method.

42 . The camera of claim 40 wherein the imaging surface comprises an array of charge coupled devices.

43 . The camera of claim 40 wherein the imaging device is mounted to the substrate by conductive bumps.

44 . A camera comprising:

a. a base substrate having an aperture;

b. an imaging device having an imaging surface, wherein the imaging surface is coupled to the base substrate such that the imaging surface is exposed through the aperture; and

c. An actuator having at least one optical element coupled to the base substrate such that light passing through the at least one optical element then impinges on the imaging surface.

45 . The camera of claim 44 wherein the imaging device is mounted to base substrate by a flip chip method.

46 . The camera of claim 44 wherein the imaging surface comprises an array of charge coupled devices.

47 . The camera of claim 44 wherein the imaging device is mounted to the substrate by conductive bumps.

48 . A method of manufacturing an ultra compact camera housing comprising mounting an imaging device, the image sensor having an image sensing surface, to a second surface of a base substrate using flip chip techniques, the base substrate having an aperture, such that the image sensing surface is exposed through the aperture.