IP Library Assignment 025932/0663
Patent Assignment
Reel/Frame 025932/0663

Assignment of Assignor's Interest

Recorded: 2011-03-10 Pages: 4
Assignors
FUKUSHIMA, ATSUSHI
Executed: 2011-02-28
SHINDO, YUICHIRO
Executed: 2011-02-28
SHIMAMOTO, SUSUMU
Executed: 2011-02-28
Assignee
JX NIPPON MINING & METALS CORPORATION
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8164, JAPAN
Covered Property (1)
High-Purity Copper or High-Purity Copper Alloy Sputtering Target, Process for Manufacturing the Sputtering Target, and High-Purity Copper or High-Purity Copper Alloy Sputtered Film
Patent: 9,441,289 →
Application: 13/063,050 →
Publication: US 2011/0163447
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Mar 29, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 042109/0069 →
Change of Address Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →