Patent Assignment
Reel/Frame 025934/0060
Assignment of Assignor's Interest
Recorded: 2011-03-10
Pages: 4
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Method, Bonding Apparatus, and Manufacturing Method of Semiconductor Device Unsing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.