IP Library › Assignment 025941/0596
Patent Assignment
Reel/Frame 025941/0596

Assignment of Assignor's Interest

Recorded: 2011-03-11 Pages: 4
Assignors
SIANG, NG KOK
Executed: 2011-03-10
LOON, WONG WAI
Executed: 2011-03-10
Assignee
SPANSION LLC
915 DEGUINE DRIVE, P.O. BOX 3453, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property (1)
Mixed Wire Bonding Profile and Pad-Layout Configurations in Ic Packaging Processes for High-Speed Electronic Devices
Patent: 9,184,151 →
Application: 13/046,433 →
Publication: US 2012/0228783
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Assignment of Assignor's Interest Jun 8, 2015
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 035857/0348 →
Assignment and Assumption of Security Interest in Intellectual Property Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst. Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
Release of Security Interest Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →