Mixed wire bonding profile and pad-layout configurations in IC packaging processes for high-speed electronic devices
View Patent ↗A method and apparatus for mixed wire bonding and staggered bonding pad placement. A first plurality of bonding pads is arranged on a semiconductor device. A second plurality of bonding pads is also arranged on the semiconductor device. The bonding pads of the second plurality of bonding pads are arranged in a staggered pattern, such that the first and second pluralities of bonding pads form one of a plurality of double rows of bonding pads on the semiconductor device.
1. A semiconductor device comprising:
a first plurality of bonding pads arranged on a semiconductor device; and
a second plurality of bonding pads arranged on the semiconductor device, wherein the first plurality of bonding pads forms a first row in a first plane parallel to a first edge of the semiconductor device, and the second plurality of bonding pads forms a second row in a second plane parallel to the first edge, the first plane proximal to the first edge, wherein one of the first plurality of bonding pads and one of the second plurality of bonding pads forms a differential pair, and wherein wires bonded to the first and second pluralities of bonding pads each extend to associated external bond fingers arranged in a single row parallel to the first edge of the semiconductor device, wherein a spacing between the wires bonded to the one of the first plurality of bonding pads and the one of the second plurality of bonding pads of the differential pair remains substantially uniform, wherein spacing between second bonding pads of the second plurality of bonding pads is variable.
2. The semiconductor device of claim 1 , wherein a first wire bonded to a first bonding pad of the first plurality of bonding pads is of a different diameter than a second wire bonded to a second bonding pad of the first plurality of bonding pads, and wherein a third wire bonded to a third bonding pad of the second plurality of bonding pads is of a different diameter than a fourth wire bonded to a fourth bonding pad of the second plurality of bonding pads.
3. The semiconductor device of claim 2 , wherein the third bonding pad of the second plurality of bonding pads is positioned such that the third wire bonded to the third bonding pad is a substantially uniform distance from the first wire bonded to the first bonding pad of the first plurality of bonding pads.
4. The semiconductor device of claim 2 , wherein the first wire and the third wire have the same diameter.
5. The semiconductor device of claim 2 , wherein the second wire and the fourth wire have the same diameter.
6. The semiconductor device of claim 4 , wherein a diameter of the first wire and the third wire is one of 0.8-0.9 mils and 1.0-1.1 mils.
7. The semiconductor device of claim 5 , wherein a diameter of the second wire and the fourth wire is one of 0.8-0.9 mils and 1.0-1.1 mils.
8. The semiconductor device of claim 1 , wherein a fifth bonding pad of the second plurality of bonding pads is positioned such that a fifth wire bonded to the fifth bonding pad is a substantially uniform distance from a sixth wire bonded to a sixth bonding pad of the first plurality of bonding pads.
9. The semiconductor device of claim 8 , wherein the substantially uniform distance provides for a maximum mutual inductance effect.
10. The semiconductor device of claim 3 , wherein the substantially uniform distance provides for a maximum mutual inductance effect.
11. The semiconductor device of claim 1 , wherein the first and second pluralities of bonding pads are 100-150 microns apart and nominal pad-size of 60×60 to 80×80 microns (width*height).
12. A method of manufacturing a semiconductor device comprising:
arranging a first plurality of bonding pads on the semiconductor device; and
arranging a second plurality of bonding pads on the semiconductor device, the first plurality of bonding pads forming a first row in a first plane parallel to a first edge of the semiconductor device, and the second plurality of bonding pads forming a second row in a second plane parallel to the first edge, the first plane proximal to the first edge, one of the first plurality of bonding pads and one of the second plurality of bonding pads forming a differential pair, and wherein wires bonded to the first and second pluralities of bonding pads each extend to associated external bond fingers arranged in a single row parallel to the first edge of the semiconductor device, wherein a spacing between the wires bonded to the one of the first plurality of bonding pads and the one of the second plurality of bonding pads of the differential pair remains substantially uniform, wherein spacing between second bonding pads of the second plurality of bonding pads is variable.
13. The method of manufacturing the semiconductor device of claim 12 , wherein a first wire bonded to a first bonding pad of the first plurality of bonding pads is of a different diameter than a second wire bonded to a second bonding pad of the first plurality of bonding pads, and wherein a third wire bonded to a third bonding pad of the second plurality of bonding pads is of a different diameter than a fourth wire bonded to a fourth bonding pad of the second plurality of bonding pads.
14. The method of manufacturing the semiconductor device of claim 13 , wherein the third bonding pad of the second plurality of bonding pads is positioned such that the third wire bonded to the third bonding pad is a substantially uniform distance from the first wire bonded to the first bonding pad of the first plurality of bonding pads.
15. The method of manufacturing the semiconductor device of claim 13 , wherein the first wire and the third wire have the same diameter.
16. The method of manufacturing the semiconductor device of claim 13 , wherein the second wire and the fourth wire have the same diameter.
17. The method of manufacturing the semiconductor device of claim 15 , wherein a diameter of the first wire and the third wire is one of 0.8-0.9 mils and 1.0-1.1 mils.
18. The method of manufacturing the semiconductor device of claim 16 , wherein a diameter of the second wire and the fourth wire is one of 0.8-0.9 mils and 1.0-1.1 mils.
19. The method of manufacturing the semiconductor device of claim 12 , wherein a fifth bonding pad of the second plurality of bonding pads is positioned such that a fifth wire bonded to the fifth bonding pad is a substantially uniform distance from a sixth wire bonded to a sixth bonding pad of the first plurality of bonding pads.
20. The method of manufacturing the semiconductor device of claim 19 , wherein the substantially uniform distance provides for a maximum mutual inductance effect.
21. The method of manufacturing the semiconductor device of claim 14 , wherein the substantially uniform distance provides for a maximum mutual inductance effect.
22. The method of manufacturing the semiconductor device of claim 13 , wherein the first wire and the second wire are bonded to the first and second bonding pads of the first plurality of bonding pads, respectively, in separate wire bonding steps, and wherein the third wire and the fourth wire are bonded to the third and the fourth bonding pads of the second plurality of bonding pads, respectively, in separate wire bonding steps.
23. The semiconductor device of claim 12 , wherein the first and second pluralities of bonding pads are 100-150 microns apart.
24. A process comprising:
a means for arranging a first plurality of bonding pads on the semiconductor device; and
a means for arranging a second plurality of bonding pads on the semiconductor device, the first plurality of bonding pads forming a first row in a first plane parallel to a first edge of the semiconductor device, and the second plurality of bonding pads forming a second row in a second plane parallel to the first edge, the first plane proximal to the first edge, one of the first plurality of bonding pads and one of the second plurality of bonding pads forming a differential pair, wherein wires bonded to the first and second pluralities of bonding pads each extend to associated external bond fingers arranged in a single row parallel to the first edge of the semiconductor device, wherein a spacing between the wires bonded to the one of the first plurality of bonding pads and the one of the second plurality of bonding pads of the differential pair remains substantially uniform, wherein spacing between second bonding pads of the second plurality of bonding pads is variable.
25. The process for manufacturing the semiconductor device of claim 24 , wherein a first wire bonded to a first bonding pad of the first plurality of bonding pads is of a different diameter than a second wire bonded to a second bonding pad of the first plurality of bonding pads, and wherein a third wire bonded to a third bonding pad of the second plurality of bonding pads is of a different diameter than a fourth wire bonded to a fourth bonding pad of the second plurality of bonding pads.
26. The process for manufacturing the semiconductor device of claim 25 , wherein the third bonding pad of the second plurality of bonding pads is positioned such that the third wire bonded to the third bonding pad is a substantially uniform distance from the first wire bonded to the first bonding pad of the first plurality of bonding pads.
27. The process for manufacturing the semiconductor device of claim 24 , wherein the first and second pluralities of bonding pads are 100-150 microns apart and nominal pad-size of 60×60 to 80×80 microns (width*height).