Assignment of Assignor's Interest

Recorded: 2011-03-14 Pages: 25

Assignor

NUVOTRONICS, LLC

Executed: 2010-08-31

Assignee

IP CUBE PARTNERS CO. LTD.

2804 S-TRENUE, 26 YEOUIDO-DONG, YEONGDEUNGPO-GU, SEOUL, 150-879, KOREA, REPUBLIC OF

Covered Properties (10)

Open Face Optical Fiber Array for Coupling to Integrated Optic Waveguides and Optoelectronic Submounts

Patent: 6,866,426 →

Application: 09/614,155 →

Methods and Devices for Coupling Optoelectronic Packages

Patent: 6,848,839 →

Application: 09/827,183 →

Publication: US 2001/0031117

Optical Device Package

Patent: 6,932,519 →

Application: 09/966,973 →

Publication: US 2003/0081914

Optical Bench with Alignment Subassembly

Patent: 6,898,029 →

Application: 09/988,055 →

Publication: US 2004/0057686

Optical Device Package for Flip-Chip Mounting

Patent: 6,883,977 →

Application: 10/013,084 →

Publication: US 2003/0095759

Optoelectronic Submount Having an on-Edge Optoelectronic Device

Patent: 6,917,056 →

Application: 10/066,299 →

Publication: US 2003/0137022

Combined Wet and Dry Etching Process for Micromachining of Crystalline Materials

Patent: 6,885,786 →

Application: 10/071,261 →

Publication: US 2003/0020130

Solder Pads and Method of Making a Solder Pad

Patent: 6,902,098 →

Application: 10/126,491 →

Publication: US 2003/0051912

Etching Process for Micromachining Crystalline Materials and Devices Fabricated Thereby

Patent: 6,907,150 →

Application: 10/199,476 →

Publication: US 2003/0067049

Solder Pads and Method of Making a Solder Pad

Patent: 6,927,492 →

Application: 10/925,410 →

Publication: US 2005/0023676