Patent Assignment
Reel/Frame 025976/0256
Assignment of Assignor's Interest
Recorded: 2011-03-17
Pages: 2
Assignors
YU, CHIH-KUANG
Executed: 2011-03-14
CHERN, CHYI SHYUAN
Executed: 2011-03-14
HSIA, HSING-KO
Executed: 2011-03-14
KUO, HUNG-YI
Executed: 2011-03-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Methods of Fabricating Light Emitting Diode Packages
Patent:
8,241,932 →
Application:
13/050,549 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0600 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0983 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →