Patent Assignment
Reel/Frame 037805/0600
Merger
Recorded: 2016-02-23
Pages: 13
Assignor
CHIP STAR LTD.
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Properties
(10)
Method of Separating Light-Emitting Diode from a Growth Substrate
Double Flip-Chip Led Package Components
Led Flip-Chip Package Structure with Dummy Bumps
Thermally-Enhanced Hybrid Led Package Components
Methods of Fabricating Light Emitting Diode Packages
Patent:
8,241,932 →
Application:
13/050,549 →
Led Phosphor Patterning
Application:
13/150,449 →
Publication:
US 2012/0305956
Led with Embedded Doped Current Blocking Layer
Application:
13/405,906 →
Publication:
US 2013/0221320
Method to Remove Sapphire Substrate
Application:
14/057,053 →
Publication:
US 2015/0108424
Method and System for Adjusting Light Output from a Light Source
Application:
14/334,709 →
Publication:
US 2014/0319318
Photonic Devices with Embedded Hole Injection Layer to Improve Efficiency and Droop Rate
Application:
14/533,219 →
Publication:
US 2015/0055671
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 17, 2011
From: YU, CHIH-KUANG; CHERN, CHYI SHYUAN; HSIA, HSING-KO; KUO, HUNG-YI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025976/0256 →
Assignment of Assignor's Interest
Jan 15, 2014
From: HUANG, HUNG-WEN; HSIA, HSING-KUO; CHIU, CHING-HUA
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031975/0582 →
Assignment of Assignor's Interest
Jul 18, 2014
From: HUANG, HSIN-CHIEH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 033339/0302 →
Assignment of Assignor's Interest
Jul 18, 2014
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 033339/0316 →
Assignment of Assignor's Interest
Nov 5, 2014
From: LI, ZHEN-YU; YANG, TZU-TE; LIN, HON-WAY; LIN, CHUNG-PAO
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034105/0574 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0983 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →