IP Library Assignment 026022/0638
Patent Assignment
Reel/Frame 026022/0638

Merger

Recorded: 2011-03-25 Pages: 3
Assignor
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property (1)
Embedded Chip Package Structure with Chip Support Protruding Section
Patent: 7,973,398 →
Application: 11/798,139 →
Publication: US 2007/0210423
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 26, 2007
From: HSU, SHIH-PING
To: PHOENIX PRECISION TECHNOLOGY CORPORATION
Reel/Frame 019654/0819 →