Patent Assignment
Reel/Frame 026055/0435
Assignment of Assignor's Interest
Recorded: 2011-03-31
Pages: 3
Assignee
XINTEC INC.
4F., NO. 25, JILIN RD.,, JHONGLI CITY, TAOYUAN COUNTY, 320, TAIWAN
Covered Property
(1)
Chip Package with Heavily Doped Regions and Fabrication Method Thereof