Patent Assignment
Reel/Frame 026061/0769
Assignment of Assignor's Interest
Recorded: 2011-04-01
Pages: 3
Assignor
KAMIKAWA, YUJI
Executed: 2011-03-07
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method and Storage Medium