Patent Assignment
Reel/Frame 026062/0916
Assignment of Assignor's Interest
Recorded: 2011-04-01
Pages: 3
Assignors
AKIYAMA, SHINICHI
Executed: 2011-02-01
YOSHINO, HIROAKI
Executed: 2011-02-01
TEI, SHINSUKE
Executed: 2011-02-01
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device and Wire Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.