Assignment of Assignor's Interest

Recorded: 2011-04-01 Pages: 4

Assignors

NAH, JAE-WOONG

Executed: 2010-09-21

SHIH, DA-YUAN

Executed: 2010-12-29

Assignee

NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504

Covered Property (1)

Copper Post Solder Bumps on Substrate

Patent: 8,669,137 →

Application: 13/078,807 →

Publication: US 2012/0252168