Patent Assignment
Reel/Frame 026079/0371
Assignment of Assignor's Interest
Recorded: 2011-04-05
Pages: 3
Assignor
LEE, KYOUNG-WOO
Executed: 2011-03-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, GEORGIA
Covered Property
(1)
Methods of Forming Wiring Structures