Patent Assignment
Reel/Frame 026098/0101
Assignment of Assignor's Interest
Recorded: 2011-04-08
Pages: 3
Assignors
BHATT, ASHWINKUMAR C.
Executed: 2011-02-25
CARD, NORMAN A.
Executed: 2011-02-28
BUCHTER, CHARLES
Executed: 2011-02-25
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NEW YORK, 13760
Covered Property
(1)
Method of Cavity Forming on a Buried Resistor Layer Using a Fusion Bonding Process
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
Security Agreement
Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
Release of Security Interest
Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest
Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →