Patent Assignment
Reel/Frame 026108/0978
Assignment of Assignor's Interest
Recorded: 2011-03-25
Pages: 4
Assignors
KIM, DONG-HAN
Executed: 2011-03-10
PARK, SUNG-WOO
Executed: 2011-03-24
PARK, JIN-WOO
Executed: 2011-03-24
LIM, SO-YOUNG
Executed: 2011-03-11
KIM, JUNG-HWAN
Executed: 2011-03-24
BAE, KWANG-JIN
Executed: 2011-03-24
LEE, PA-LAN
Executed: 2011-03-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Housing Package, Semiconductor Package Structure Including the Semiconductor Housing Package, and Processor-Based System Including the Semiconductor Package Structure