Patent Assignment
Reel/Frame 026125/0499
Assignment of Assignor's Interest
Recorded: 2011-04-14
Pages: 2
Assignors
CHERN, CHYI SHYUAN
Executed: 2011-04-11
WU, HSIN-HSIEN
Executed: 2011-04-11
CHANG, CHUN-LIN
Executed: 2011-04-12
HSIA, HSING-KUO
Executed: 2011-04-11
KUO, HUNG-YI
Executed: 2011-04-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Methods of Forming Through Silicon via Openings
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 4, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027990/0013 →
Change of Name
Nov 24, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037158/0101 →
Merger
Nov 24, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037158/0154 →