IP Library › Assignment 027990/0013
Patent Assignment
Reel/Frame 027990/0013

Assignment of Assignor's Interest

Recorded: 2012-04-04 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Methods of Forming Through Silicon via Openings
Patent: 8,716,128 →
Application: 13/086,542 →
Publication: US 2012/0264296
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 14, 2011
From: CHERN, CHYI SHYUAN; WU, HSIN-HSIEN; CHANG, CHUN-LIN; HSIA, HSING-KUO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026125/0499 →
Change of Name Nov 24, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037158/0101 →
Merger Nov 24, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037158/0154 →