Patent Assignment
Reel/Frame 026132/0466
Assignment of Assignor's Interest
Recorded: 2011-04-15
Pages: 3
Assignors
WU, CHUN-YUAN
Executed: 2011-04-08
LIU, CHIH-CHIEN
Executed: 2011-04-08
LIN, CHIN-FU
Executed: 2011-04-08
CHEN, PO-CHUN
Executed: 2011-04-08
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method of Forming Opening on Semiconductor Substrate