Patent Assignment
Reel/Frame 026153/0687
Assignment of Assignor's Interest
Recorded: 2011-04-20
Pages: 2
Assignor
INOUE, KAZUO
Executed: 2011-03-02
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Disk Substrate Molding Apparatus, Disk Substrate Molding Method and Disk Substrate Molding Die