Patent Assignment
Reel/Frame 026159/0953
Assignment of Assignor's Interest
Recorded: 2011-04-08
Pages: 2
Assignors
CHO, SUNG-IL
Executed: 2011-03-21
JIN, HO-TAE
Executed: 2011-03-21
KIM, HEUI-SEOG
Executed: 2011-03-21
OH, SEON-JU
Executed: 2011-03-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Processing a Substrate Using a Laser Beam