Patent Assignment
Reel/Frame 026186/0983
Assignment of Assignor's Interest
Recorded: 2011-04-27
Pages: 2
Assignors
BAIK, CHAN-WOOK
Executed: 2011-04-08
KIM, JONG-MIN
Executed: 2011-04-08
LEE, CHANG-WON
Executed: 2011-04-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Layered Hybrid Metamaterial Structure